Robotic Joint Modul

Industry Classification
Robot core components Integrated Joints
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Product Description

Integrated Joint Module for Embodied Intelligence
This product is a high-performance, integrated joint module specifically engineered for next-generation humanoid robots and high-end intelligent equipment. It innovatively adopts an integrated architecture combining "terminal motor control with top-level centralized control," deeply fusing drive, sensing, transmission, and control algorithms to deliver a comprehensive motion control solution for embodied intelligence.
Hardware Architecture
The module utilizes Gallium Nitride (GaN), a third-generation semiconductor, as the core power component, significantly reducing losses and enhancing power density. Paired with a frameless motor and a cycloidal reducer, it achieves an optimal balance between physical footprint and performance.

Key Highlights
• Ultra-Compact Design & High Power Density: By employing a frameless motor and an optimized internal stacking process, the module reduces diameter by 30% and increases power density by 70% compared to traditional solutions. This effectively addresses the "bulky joint" pain point in embodied intelligence, resulting in a more human-like robot morphology and greater agility.
• Silent Operation & High-Precision Control: Leveraging the high-frequency characteristics of GaN devices, the switching frequency is increased fivefold, drastically reducing current ripple and operational noise to ensure quiet performance in complex environments. Additionally, it features high back-drivability, providing superior output torque and holding force.
• Enhanced Impact Resistance: The adoption of a cycloidal reducer structure improves impact resistance by over 50% compared to traditional solutions. This ensures more stable and robust motion execution when the robot encounters sudden external forces or navigates complex terrain.

Target Applications
This module is widely applied in the manufacturing of humanoid robots, industrial collaborative arms, high-end service robots (such as medical assistance and home companionship), and special-purpose operation robots. It serves as a core executive unit in building the infrastructure for the intelligent society of the future.

Product Specifications

Our product line spans five models ranging from 15Nm to 75Nm, precisely catering to diverse load requirements. The hollow-series (75/30/15Nm) is engineered for cable integration and precision sensing, while the non-hollow series (65/30Nm) achieves a breakthrough in power density, increasing it by 70% through extreme lightweight design.
The entire lineup comes standard with cycloidal reducers, enhancing impact resistance by over 50% to ensure stable and robust motion execution. On the hardware front, all models incorporate Gallium Nitride (GaN), a third-generation semiconductor, which increases the switching frequency fivefold, significantly reducing ripple and noise.
In terms of communication, the modules offer comprehensive support for both EtherCAT and CAN FD protocols, delivering millisecond-level real-time data interaction. This portfolio provides a full-scenario, high-performance solution for embodied intelligence, covering applications from dexterous fingertips to torso joints.

Company Profile

深圳市优联智能控股有限公司

深圳市优联智能控股有限公司是一家专注于具身智能与人形机器人核心控制系统的高科技企业。公司以“物理AI”为技术底座,聚焦机器人“大脑+神经+关节”核心能力的自主研发,致力于打造新一代智能机器人与智能装备的基础设施平台。 公司核心团队来自清华大学、新加坡国立大学、美国田纳西大学、哈尔滨工业大学等知名高校,并长期在欧洲、日本及国内头部高端装备企业从事电力电子、工业自动化、机器人控制与人工智能相关研发工作,拥有深厚的工程化与产业化经验。 优联智能围绕具身智能控制平台、人形机器人关节模组、高性能伺服驱动系统、AI电源系统等方向持续投入研发,已形成完整的软硬件协同设计能力和平台化产品架构。 公司坚持自主创新,已申请多项发明专利和软件著作权,致力于推动我国在智能机器人核心技术领域实现国际领先与国产替代。
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