Overview

Overview About the Organizer Organizational Structure Exhibit Categories Exhibition Highlights Previous Exhibitions Exhibition Hall Introduction Downloads

IProject background

Over the past decade, China’s robotics industry has experienced rapid growth. As the world’s largest robotics market to date, China has validated the scalability and reliability of its domestically developed core components through large-scale industrial applications. Meanwhile, its overall robotics manufacturing capabilities are increasingly being exported to global markets.

At the same time, the robotics industry is integrating more closely with AI, experiencing a possible change in the technological paradigm: AI is moving from the information world to the physical world, and robots are moving from specialised intelligence to generalised intelligence. This process will surely brew and unleash more opportunities. Against this background, from 2025, Shenzhen Robotics Association (SRA), together with domestic and international academic authorities, industry elites, industrial organisations, as well as people from all walks of life who care about the development of the industry, will co-found the world's first robotics development and technology exhibition, FAIR plus, to promote global robotics development through supply chain and innovative technologies. We will take supply chain and innovative technology as the entry point to promote the development of the global body-intelligent robot industry.

II. Project title

Chinese name: 机器人全产业链接会

English name: Fair of AI and Robotics, plus (FAIR plus)

Name Interpretation: FAIR is derived from the initials of Fair of AI and Robotics, representing an exhibition and showcase platform focused on artificial intelligence and robotics. Plus represents the additional value, enhancement, and extension beyond a traditional exhibition format. Within the context of the event, “plus” embodies multiple meanings, including but not limited to:

1. Showcase the mature robotics industry chain and facilitate the integration of established industries into the robotics sector.

2. Bridging gaps and exploring missing technological and industrial links in the integration of artificial intelligence and robotics.

3. Exploring and validating new possibilities and better solutions for robotics applications.

III. Project Value

FAIR plus is a platform dedicated to robotics technologies and development resources across the entire industry value chain. Through academic conferences, technical standards, community building, and supply-demand matchmaking, FAIR plus creates opportunities for offline collaboration among developers, product specialists, engineers, solution providers, and other technical professionals across the AI and robotics value chain, as well as process, equipment, and IT professionals from industries seeking to adopt robotics solutions. By facilitating connections and partnerships, FAIR plus aims to accelerate the intelligent evolution of robotics while strengthening the overall capabilities, infrastructure, and ecosystem development of the industry.

  •  Bringing Together the Entire Robotics Value Chain,the Most Concentrated Professional Robotics Exhibition

Serving diverse application scenarios, FAIR plus focuses on key areas across the robotics value chain, including electromechanical modules, control algorithms, and complete system integration. It builds a one-stop platform integrating development and manufacturing resources, fostering collaborative innovation across the industry chain and accelerating industrial transformation.

  •  A Premier Technology Conference Bringing Together Academia and Industry

Under the guidance of FAIR plus’s chairman organization, the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (SIAT, CAS), the event is co-organized with leading organizations including the VDMA Robotics + Automation Association in Germany (Secretariat of the International Federation of Robotics, IFR) and Science Robotics to foster deeper collaboration and exchange between industry and academia.

  •  Scenario-Driven Collaboration, Enabling Technology Matching and Collaborative Innovation Across the Value Chain

Driven by real-world application scenarios, FAIR plus emphasizes collaborative innovation across the robotics value chain. Through joint development initiatives, it facilitates technology matching and industry partnerships, fostering a new paradigm of scenario-based robot customization and building an interconnected network of industry resources.

  •  Creating a New Role in Global Collaboration and Establishing a Strategic Position in the Hardware Ecosystem

Through FAIR plus’s positioning and global communication efforts, a more open and collaborative image of the robotics industry is being shaped, strengthening China’s role in international robotics cooperation by leveraging its hardware ecosystem advantages. FAIR plus aims to establish two key roles: Role 1: Empowering global robotics innovators with China’s manufacturing capabilities by providing accessible hardware development kits and manufacturing resources for emerging robotics players worldwide. Role 2: Providing hardware platforms for global AI innovators through embodied intelligence products such as humanoid robots, enabling model validation, real-world testing, and data collection for AI development.

IV. Project information

Event Dates: April 21–23, 2027

Venue: Hall 1, Shenzhen Convention & Exhibition Center (Futian)

Exhibition Area: 30,000㎡ (15,000㎡ in 2026)

Event Format: Full-Chain Showcase — FAIR plus

Forum on Intelligent Robot Science and Technology

POWER Robot Future Conference

MATCH Series: Supply Chain Innovation & Matching

UNITED Series: Standards & Community Ecosystem

Overseas Matchmaking Sessions

Open Mic + Parallel Events + ......

Scale: 50+ Embodied Intelligence Robotics Industry Segments

600+ Robotics Upstream Component and Complete Robot Companies Showcasing Physical Products

80+ Concurrent Events and 300+ Speakers

80,000+ Professional Visitors and 100+ Overseas Buyer Groups

V. FAIR plus Exhibition Scope

1. Core Robotics Components (Including Mature and Innovative Products)

Control Systems, Servo Systems (servo drives, servo motors, encoders, etc.), Transmission Systems (reducers, servo actuators, bearings, ball screws, worm gears, etc.), Sensors (vision sensors, force sensors, tactile sensors, etc.), Integrated Joints, Actuators (dexterous hands, tooling fixtures, etc.), Mobile Platforms, Power Systems (batteries, power electronics, etc.), Connectivity & Communication Systems (cables, wiring harnesses, connectors, etc.), Key Materials, and more.

2. Brain-Related Technologies (AI Algorithms and More)

 Data Collection and Acquisition Equipment, Data Standard Providers and Platforms, Perception Solutions and Algorithm Providers, Simulation Tools and Modeling Companies, Software Systems, Software Tools and Infrastructure, Computing Chips and Platforms, Memory Chips, Edge Computing Devices, Cloud Services, IoT Components, and related technologies.

3. Whole Robot Development, Design, and System Integration;

4. Robotics Manufacturing Equipment, Production Lines, Contract Manufacturers, and Related Services

5. Robotics Inspection, Maintenance, Repair, Testing & Validation, and Related Services

VI. Concurrent Events

(I) Opening Ceremony

Government representatives, academic authorities, industry leaders, exhibitors, and media representatives will be invited to attend and witness the official launch of the event. The ceremony will feature the release of the Shenzhen Robotics Industry Development White Paper (since 2014, commissioned by the Shenzhen Municipal Bureau of Industry and Information Technology, the Shenzhen Robotics Association has continuously compiled and published the report for 11 consecutive years, documenting the development of Shenzhen’s robotics industry driven by policy support). The ceremony will also witness the launch of the new book Research on Innovative Application Scenarios of “Robotics +”, as well as the kick-off ceremony of events such as the First National Safety and Emergency Robotics Competition.

(ii)Forum on Intelligence Robot Science and Technology

FIRST (Forum on Intelligent Robot Science and Technology) is the abbreviation for the Forum on Intelligent Robot Science and Technology, hereinafter referred to as the “FIRST Forum.” The forum will invite academicians, industry leaders, and leading experts to deliver keynote speeches and participate in high-level dialogues. The FIRST Forum will feature 8 sessions, including the Main Industry Forum co-organized with the VDMA Robotics + Automation Association (Secretariat of the International Federation of Robotics, IFR), as well as the academic session “From Concept to Reality: Bringing Intelligent Agents into the Real World” co-organized with Science Robotics. In addition, 7 parallel forums will explore cutting-edge technologies and application breakthroughs in robotics across key fields including industrial manufacturing, home services, agriculture, marine applications, emergency and safety, surgical healthcare, and rehabilitation & wellness.

(III) POWER Robot Future Conference

Co-organized with the Shenzhen Venture Capital Association and other partners, POWER represents Pioneer, Optimal, Wisdom, Empower, and Robotics. The summit focuses on frontier innovation, optimal resource allocation, industry insights, capital empowerment, and robotics verticals. It will bring together industry leaders and investment experts for in-depth discussions on technology breakthroughs, commercialization, capital support, and global expansion, providing insights into industry trends and emerging opportunities. The POWER series will also feature supporting activities such as project roadshows and professional training sessions.

(iv) UNITE Series: Standards & Community Ecosystem

Through the development of technical standards, joint organization of technology communities, and co-hosting of ecosystem programs, FAIR plus aims to create a collaborative environment for technical talent exchange. The event will work with technology communities such as Siemens Xcelerator, ROSCon China (Gouyueju), OSCHINA, JLC, and Xbotics to jointly organize and support community activities held during the event. FAIR plus will also support ecosystem programs such as Zhiyou · Yari i⁵Robot and Mars Accelerator Camp in conducting member activities. In addition, the event will bring together initiatives such as the national standards working group for the Specification for Data Collection and Model Training for Embodied Intelligence Training Bases Based on High-Quality Datasets to advance standards development. It will also collaborate with TÜV to organize seminars on CE certification standards for humanoid robots and related topics.

（(V)）MATCH Series: Supply Chain Innovation & Matching

Leveraging the “Robot+” Challenge-Based Innovation Program policies of Nanshan District, Shenzhen, FAIR plus will invite application scenario providers from across China to release challenge lists before the event and organize on-site requirement briefings. The event will also facilitate closed-door matchmaking sessions between robotics companies and demand-side partners nationwide, accelerating the implementation of challenge-based innovation projects and fostering industry collaboration.

(vi) Overseas Matchmaking Sessions

FAIR plus has invited more than 10 presidents of national-level robotics associations to attend the event. Dedicated matchmaking sessions will also be organized for dozens of overseas professional buyer delegations, including Germany, Thailand, the Netherlands, Japan, Finland, and other international markets.

(vii) Open mic + parallel events + others

Through open-mic sessions, FAIR plus will invite leading companies to showcase their products, present new technologies, and launch significant new products, allowing participants to witness the latest achievements in robotics innovation. The exhibition platform will also be open to support robotics-focused entrepreneur networking activities organized by alumni associations of leading universities, including Tsinghua University, the University of Science and Technology of China (USTC), and Harbin Institute of Technology (HIT).