Next Generation Robot Intelligence Core - “Big and Small Brain and Key Device Innovation” Forum

Next Generation Robot Intelligence Core - “Big and Small Brain and Key Device Innovation” Forum

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13.40-13:45The starter opens the show
13:45-14:05Conference Report: Heterogeneous Casting, Software Empowering the Soul, Agaricus' Way of End-side Intelligence
Buchun Gao, Head of Robotics Division, AgaRhinoceros
14:05-14:25Report of the General Assembly:“Renesas empowers robotics applications with ”core" direction, travelling to the futureChen Xudian, Principal Engineer, Renesas FAE
14:25-14:45Conference Report: NXP's Multi-Core Array Builds a Strong Foundation for Intelligent EngineeringJason, Marketing Manager, NXP
14:45-15:05Conference Report: Mainstream Application of Highly Reliable Connectors in Small and Large Brains
Li Peiyong, Sales Director, Molex
15:05-15:25Conference Report: Integrated Storage Innovation Enabling AI Robotics Development (proposed)
Hua Guojun, Senior Product Director, Jiang Bolong
15:25-15:45Conference Report: ADI Technology Enables Innovation in Humanoid Robotics
Guangsheng Lu, Senior FAE, ADI
15:45-16:05Conference Report: Sharing Innovative Solutions for Robotic Applications
Shen Yipeng, Deputy General Manager, Firefly Workshop, CLP Hong Kong
Next Generation Robot Intelligence Core - “Big and Small Brain and Key Device Innovation” Forum

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