Press Fit Interconnect Solution&Insulation Displacement Contact Technology

Industry Classification
Robot core components Transmission systems (gearboxes, servos, bearings, screws, worm gears, etc.)
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Product Description

Our Press-Fit interconnect solutions provide an excellent solder-free alternative for creating robust electro-mechanical connections that are customizable automation friendly and have proven reliable with billions of deployments (widely used in Automotive Consumer Electronics Industrial ect) in the field. Available in a wide range of sizes materials and plating finishes (Option for IndiCoat™ a tin-free whisker mitigation plating developed by ENNOVI) our Press-Fit products can also be customized to virtually any application. With the ability to accommodate thermal expansion mismatches Press-Fit eliminates the risk of breakage and failures inherent to solder joints. IDC (Insulation displacement contact) technology allows for the assembly of a specially stamped terminal onto insulated magnet wire in such a way that removes the enamel insulation of the magnet wire and establishes an electro-mechanical connection to wire without using solder. This technology has been widely used in Automotive Consumer Eelctronics Medical White goods/Industrial market. ENNOVI IDC technology is able to penetrate thick varnish coatings can support high current and high temperature applications can be designed for various application terminations with large wire diameter range and resilient flexible design.

Product Specifications

一、Press Fit Interconnect Solution 1. PRODUCT FAMILY:Mini、PRESS-FIT TYPE: 0.4 miniPLX、FINISHED PCB HOLE DIAMETER (MM):Ø0.55 - 0.65、INSERTION FORCE1:≤ 100 N、PUSH-OUT FORCE:≥ 15 N 2. PRODUCT FAMILY:Mini、PRESS-FIT TYPE: 0.4 miniEON、FINISHED PCB HOLE DIAMETER (MM):Ø0.55 - 0.65、INSERTION FORCE1:≤ 70 N、PUSH-OUT FORCE:≥ 15 N 3. PRODUCT FAMILY:Signal、PRESS-FIT TYPE: 0.4 EON、FINISHED PCB HOLE DIAMETER (MM):Ø0.74 - 0.83、INSERTION FORCE1:≤ 70 N、PUSH-OUT FORCE:≥ 15 N 4. PRODUCT FAMILY:Signal、PRESS-FIT TYPE: 0.64 EON、FINISHED PCB HOLE DIAMETER (MM):Ø1.0 - 1.1、INSERTION FORCE1:≤ 100 N、PUSH-OUT FORCE:≥ 30 N 5. PRODUCT FAMILY:Power、PRESS-FIT TYPE: 0.8 EON、FINISHED PCB HOLE DIAMETER (MM):Ø1.45 - 1.55、INSERTION FORCE1:≤ 180 N、PUSH-OUT FORCE:≥ 60 N 6. PRODUCT FAMILY:High Power、PRESS-FIT TYPE: 1.2 EON、FINISHED PCB HOLE DIAMETER (MM):Ø2.0 – 2.1、INSERTION FORCE1:≤ 180 N、PUSH-OUT FORCE:≥ 60 N 二、Insulation Displacement Contact Technology IDCTYPE、WIRE TYPE、WIRE GAUGE 0.4 PLX、Dual wire、23-24AWG 0.64、Single wire、19.5-23AWG 0.8、Single wire、15-16.5AWG 0.8、Dual wire、17-19AWG 0.8、Single wire、17-19AWG

Company Profile

易纳纬(杭州)智能科技有限公司

ENNOVI,是Blackstone 的投资组合公司Interplex于2023年10月正式向全球市场推出新的移动出行电气化解决方案公司,作为一家新设独立公司,ENNOVI 将完全专注于汽车电气化解决方案,并为下一代电动汽车的电池、电源和信号系统提供设计与制造创新的互联解决方案。2025年我们兑现了对电气化未来的承诺,推动汽车产业实现转型升级,下一步我们将迈向“超越汽车”(航空航天、数据存储、机器人、医疗健康、消费电子),主动迎接新的挑战。 易纳纬智能科技(杭州)有限公司是ENNOVI旗下生产工艺最全和业务覆盖面最广的业务中心,1996年在杭州注册成立,于2000年正式落址钱塘区。公司凭借集团的技术优势,通过20余年的不断发展,成为了全球供应链的高端汽车电子、一线终端通讯产品和国际知名医疗器械的复杂和精密零部件供应商,受到业界全球知名客户的青睐。 易纳纬(上海)智能科技有限公司成立于 1996 年,(曾用名:安特金属成形(上海)有限公司)我们的制造能力有注塑成型、精密金属冲压、冷锻生产、汽车金属件组装,服务器机箱的组装及机加工业务,我们有全套各类测量、测试设备。产品覆盖国内,北美,欧洲等多个国家。 我们配备了先进的生产设备、检测设备和完善的质量管理体系。公司不仅具备三体系证书,ISO9001 质量体系、ISO14001环境体系、ISO45001职业健康体系。还获得IATF16949汽车质量体系、RBA证书及TISAX等证书。这不仅代表着企业的荣誉更彰显了企业的管理实力和在市场竞争中赢得更多优势。
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