Tactile Sensing Fingertip, Finger Pad and Palm Modules

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Product Description

Applied in scenarios involving embodied robots, dexterous hands and robotic arms.

Product Specifications

Module Features: - Trigger Force: 0.05 N Sensitivity - Sleek Design, High Level of Integration

Company Profile

Shenzhen Modulus Technology Co.

1. Company Profile: A company specialising in advanced haptic sensing technology, with over ten years’ experience in R&D and engineering mass production. The company possesses proprietary technologies including high-density array haptic sensing, 3D force sensing, multimodal sensing, and integrated temperature and pressure sensing. Its products are widely applicable in robotics, industrial applications, smart devices and other sectors. 2. Awards: Gaogong Golden Globe Award – Promising New Generation (Components), SRA Robotics Application Case Study Award, NVIDIA Outstanding Start-up. 3. Core Business: Flexible sensors and electronic skin, applicable to multimodal sensing scenarios in robotics, industry and smart devices.
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