3D Line Scanning Spectral Confocal

The LSCF Series Line scanning Spectral Confocal sensors employs industrial 4.0 white-light spectral confocal technology, enabling high-speed, wide-coverage line scanning while simultaneously generating 3D topography, 3D multi-layer scanning, and 2D intensity data. Compared with traditional 3D line lasers, it can scan any complex samples—including multi-layer structures, transparent/semi-transparent materials, curved edges, and highly reflective/mirror surfaces—with sub-micron precision. Its accuracy and material adaptability far exceed those of comparable 3D inspection methods. Specific applications cover the following scenarios: Display Panels LCD/OLED bending point dispensing and bonding dispensing testing μLED SPI/die defect inspection MiniLED dispensing and LED bead defect inspection 3C Electronics Mobile phone frames, cover glass (CG), camera modules Foldable screen creases, curved screen curvature 3C product assembly inspection, AR/VR module inspection, headphone adhesive dispensing inspection Semiconductors Chip electrodes, pin through-holes, packaging measurement Wafer defect inspection, electronic circuit defect detection New Energy Lithium battery electrode burrs, JIP packaging, cell end-face adhesive dispensing Metal film scratch detection, and more